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含银，高导电性，双组分环氧粘贴至480华氏度
Silver-Filled, Highly Conductive, Two-Part Epoxy Paste to 480 °F
技术参数/Specifications
| Cure / Technology | Thermoset |
| Substrate Compatibility | Ceramic, Glass; Metal |
| Features | Electrically Conductive; Thermally Conductive; Filled |
| Industry | Electronics; OEM or Industrial |
aremco债券u0026#153;-556-HT-HCAremco产品公司,环氧胶粘剂,Aremco-Bond™ , 556-HT-HC, Aremco Products, Inc., Epoxy Adhesives