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提供
玻璃基胶粘剂/与陶瓷用封口机至1450华氏度
Glass-based adhesive/sealer for use with ceramics to 1450 °F.
技术参数/Specifications
| Compound Type | Dielectric |
| Material Form | Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler; Liquid |
| Industry | Automotive; Electronics (PCB / SMT Assembly); OEM / Industrial; Porous Ceramics & Refractories |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
aremco密封u0026#153;-617,Aremco产品公司,电气树脂和电子化合物,Aremco-Seal™ , 617, Aremco Products, Inc., Electrical Resins and Electronic Compounds