Aremco – Bond的商标 616是一种先进的，由两部分组成，电气和热传导粘合剂，制定使用低成本镀银玻璃球。 该系统呈现出室温体积电阻率小于0.005欧姆厘米， 直径和W/m-光热导率0.4 连续工作温度范围为360 华氏度 （182 摄氏度 ）和间歇使用温度为400 华氏度 （205 摄氏度 ）。 拉伸剪切强度为1,000 psi和邵氏D硬度为78。 混合粘度范围在50,000至60,000处长。
Aremco – 616混合债券商标很容易在对1的比例按重量1。 它规定在室温时的温度在24楼，也可以在200小时Ø热固化2 它有一品脱，夸脱和加仑试剂盒，可分为专门双包装要求包装。 – LV的典型应用为Aremco – Bond的商标 556包括电气连接器，照明和焊接传感器作为替代。
请联系有关这种先进的新产品信息Aremco的技术销售部。
Aremco-Bondtm 616 is an advanced, two-part, electrically and thermally conductive adhesive that is formulated using low-cost silver-coated glass spheres. This system exhibits a volume resistivity of less than 0.005 ohm-cm at room temperature, and a thermal conductivity of 0.4 W/m-oK. The continuous operating temperature range is 360 oF (182 oC) and intermittent use temperature is 400 oF (205 oC). The tensile shear strength is 1,000 psi and Shore D hardness is 78. Mixed viscosity range is 50,000 to 60,000 cP.
Aremco-Bondtm 616 mixes easily in a 1-to-1 ratio by weight. It sets at room temperature in 24 hours or can be heat cured in 2 hours at 200 oF. It comes in pint, quart and gallon kits and can be specially packaged in divided bi-packs upon request. Typical applications for Aremco-Bondtm 556-LV include electrical connectors, lighting and sensors as a replacement for solder.
Please contact Aremco’s Technical Sales Department for more information about this advanced new product.
| Cure / Technology | Thermoset (optional feature); Room Temperature Vulcanizing or Curing (optional feature) |
| Substrate Compatibility | Ceramic, Glass; Metal |
| Features | Electrically Conductive; Thermally Conductive; Filled |
| Industry | Electronics; OEM or Industrial |
aremco债券u0026#153;-616,Aremco产品公司,环氧胶粘剂,Aremco-Bond™ , 616, Aremco Products, Inc., Epoxy Adhesives