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Aremco提供了一个特种粘接和应用的高性能环氧树脂灌封令人印象深刻的选择，以600 °楼 这些产品可以应用到无数的基板，提供特殊的化学，电气和机械性能。
Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties.
技术参数/Specifications
| Compound Type | Dielectric |
| Material Form | Encapsulant, Potting Compound; Gap Filler; Liquid |
| Industry | Electronics (PCB / SMT Assembly); OEM / Industrial |
| Chemical System | Epoxy |
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