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银填充，导电，丝网印刷，双组分环氧粘贴到570华氏度
Silver-Filled, Electrically Conductive, Screen Printable, Two-Part Epoxy Paste to 570 °F
技术参数/Specifications
| Material System | |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Thermoset |
| Form / Shape | Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating |
| Composition & Features | |
| Industry | Electronics; OEM or Industrial |
| Features | Electrically Conductive |
aremco债券u0026#153;-556-HT-SPAremco产品公司,导热胶和导热界面材料,Aremco-Bond™ , 556-HT-SP, Aremco Products, Inc., Thermal Compounds and Thermal Interface Materials