没有图像
提供
含银，高导电性，双组分环氧粘贴至480华氏度
Silver-Filled, Highly Conductive, Two-Part Epoxy Paste to 480 °F
技术参数/Specifications
| Material System | |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Thermoset |
| Form / Shape | Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating |
| Composition & Features | |
| Industry | Electronics; OEM or Industrial |
| Features | Electrically Conductive |
aremco债券u0026#153;-556-HT-HCAremco产品公司,导热胶和导热界面材料,Aremco-Bond™ , 556-HT-HC, Aremco Products, Inc., Thermal Compounds and Thermal Interface Materials