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含银，高导电性，双组分环氧粘贴至480华氏度
Silver-Filled, Highly Conductive, Two-Part Epoxy Paste to 480 °F
技术参数/Specifications
| Compound Type | Electrically Conductive Compound; Thermally Conductive |
| Material Form | Encapsulant or Conformal Coating; Gap Filler |
| Industry | Electronics (PCB / SMT Assembly); OEM / Industrial |
| Chemical System | Epoxy |
aremco债券u0026#153;-556-HT-HCAremco产品公司,电气树脂和电子化合物,Aremco-Bond™ , 556-HT-HC, Aremco Products, Inc., Electrical Resins and Electronic Compounds