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低熔中等压力加工工艺点胶，干血浆硅片，去镶板铜镀铁弗龙板蚀刻，切割陶瓷绿色胶带。 透明薄截面。 溶于热水。
Low melting point adhesives for moderate-stress machining processes, dry plasma etching of silicon wafers, de-paneling copper plated Teflon boards, and dicing ceramic green tape. Transparent in thin cross-sections. Soluble in hot water.
技术参数/Specifications
| Material Form | Die Bonding Adhesives; Mounting |
| Industry | Electronics (PCB / SMT Assembly); Photonics; OEM / Industrial |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
crystalbondu0026#153;-555,Aremco产品公司,电气树脂和电子化合物,Crystalbond™ , 555, Aremco Products, Inc., Electrical Resins and Electronic Compounds