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低熔中等压力加工工艺点胶,干血浆硅片,去镶板铜镀铁弗龙板蚀刻,切割陶瓷绿色胶带。 透明薄截面。 溶于热水。
Low melting point adhesives for moderate-stress machining processes, dry plasma etching of silicon wafers, de-paneling copper plated Teflon boards, and dicing ceramic green tape. Transparent in thin cross-sections. Soluble in hot water.
技术参数/Specifications
Substrate Compatibility | Ceramic, Glass; Metal |
Composition | Unfilled |
Cure / Technology | Thermoplastic |
Features | Adhesive |
Industry | Electronics; Photonics; OEM or Industrial |
crystalbondu0026#153;-555麝香保心丸,Aremco产品公司,特种胶粘剂,密封剂和化合物,Crystalbond , 555-HMP, Aremco Products, Inc., Specialty Adhesives, Sealants and Compounds